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Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.
| Bus type | QPI |
| CPU configuration (max) | 1 |
| Embedded options available | N |
| Enhanced Intel SpeedStep Technology | Y |
| Execute Disable Bit | Y |
| Idle States | Y |
| Intel 64 | Y |
| Intel Demand Based Switching | Y |
| Intel Enhanced Halt State | Y |
| Intel Flex Memory Access | N |
| Intel Trusted Execution Technology | Y |
| Intel TSX-NI | Y |
| Intel Virtualization Technology for Directed I/O (VT-d) | Y |
| Intel VT-x with Extended Page Tables (EPT) | Y |
| Maximum internal memory | 524288 MB |
| Maximum number of PCI Express lanes | 48 |
| PCI Express configurations | 1x16,1x4,1x8 |
| PCI Express slots version | 3.0 |
| Physical Address Extension (PAE) | 46 bit |
| Processor boost frequency | 4.30 GHz |
| Processor cache | 19456 KB |
| Processor codename | Skylake |
| Processor cores | 14 |
| Processor frequency | 2.50 GHz |
| Processor lithography | 14 nm |
| Processor model | W-2175 |
| Processor socket | LGA 2066 |
| Processor threads | 28 |
| Product type | 4 |
| Scalability | 1S |
| Supported instruction sets | AVX,AVX 2.0,AVX-512,SSE4.2 |
| Thermal Design Power (TDP) | 140 W |
| Thermal Monitoring Technologies | Y |
| Maximum internal memory supported by processor | 512 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 1600,1866,2133,2400,2666 MHz |
| Memory bandwidth supported by processor (max) | 85.3 GB/s |
| Memory channels supported by processor | Quad |
| ECC supported by processor | Y |
| Intel Virtualization Technology (VT-x) | Y |
| Processor package size | 45 x 52.5 mm |
| Market segment | SRV |
| Status | Launched |
| Conflict Free processor | Y |
| Product family | Intel Xeon Processors |
| Intel® vPro™ Technology | Y |
| Intel® AES New Instructions (Intel® AES-NI) | Y |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Y |
| Intel® Identity Protection Technology (Intel® IPT) | Y |
| Intel® Turbo Boost Technology | 2.0 |
| Processor ARK ID | 130046 |
| Intel Turbo Boost Max Technology 3.0 | N |
| Intel® Optane™ Memory Ready | N |
| Intel® Speed Shift Technology | Y |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel W-2175
Intel® Xeon® W-2175 Processor
(19.25M Cache, 2.50 GHz)
(19.25M Cache, 2.50 GHz)
£1,739.66
Tax excluded
Intel® Xeon® W-2175 Processor
(19.25M Cache, 2.50 GHz)
(19.25M Cache, 2.50 GHz)